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Writing is the unified content surface; build notes, thinking notes, field records, and DYOR research all live in the same Articles board.
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Articles
Build notes, thinking notes, field records, and DYOR research share one filterable Articles board; DYOR still keeps dedicated visual report pages.
Dot-com vs. AI Capital Cycles: Is This Reset 1998 or 2000?
A side-by-side map of the 1995–2002 internet buildout and the 2022–2028E AI buildout, using Nasdaq drawdowns, semiconductor high beta, TSMC results, and hyperscaler CapEx to frame the current fork.
Must COR1M Spike First? A Split View on Broad-Market Strength and Tech Repair
Tests whether a sustained advance needs a COR1M spike, then validates VIX × COR1M on five years of point-in-time daily Cboe data. The pair is more useful for path-risk control than return prediction, with a conditional one-month playbook.
Post-CPI Hundred-Bagger Window: NVDA Momentum × NFLX Earnings Gamma
A live July 14 refresh using Nasdaq bid/ask, volume, open interest, and official earnings dates to separate NVDA momentum, NFLX event gamma, watchlist setups, and fake lottery prints.
China A-share × U.S. AI Hardware Earnings Calendar: Equipment, Memory and Optics
An eight-week earnings calendar for China A-share and U.S. semiconductor equipment, memory and optical names, separating confirmed dates, exchange appointments and inferred windows while tracking narrative-to-profit transmission.
China A-Share and Korean AI Hardware Theme Map: Optical Chips, MLCC, CCL, Memory and Fiber
A compact table mapping five AI hardware themes to China A-share names, onshore ETFs, feeder funds and Korean equities, with purity and proxy-risk labels.
Momentum Repair and Hundred-Bagger Options Window: July 10-17 Semi Gamma Band
A fresh scan of U.S. close momentum repair, Nasdaq option volume/OI/bid-ask, and the next short-dated semiconductor gamma window.
Weekly Short Squeeze Top 10: SNDK, WULF, IREN, CLSK and the Ignition Screen
A same-week short squeeze screen using short interest, option volume/OI, tape repair, and near-term catalysts.
July 10 Theme Squeeze Map: Optical, ABF, MLCC, Memory, Equipment, Manufacturing, Power
A same-week squeeze map across seven AI upstream themes, five names per theme, separating theme purity from U.S. short-dated option tradability.
One-Month 20-30% Upside Map: Optical, ABF, MLCC, Memory, Equipment, Manufacturing, Power
A theme-by-theme AI upstream watchlist for one-month 20-30% upside candidates, separating catalysts, purity, short fuel, options liquidity, triggers, and kill risks.
Three Trading Paths for Memory Price Declines and Capacity Expansion
A DYOR playbook separating healthy memory price declines, oversupply-driven price declines, and memory capex expansion, with beneficiaries, confirms, avoids, triggers, and risks.
Semiconductor Hundred-Bagger Options Map: Full-Universe OPEX Rescan
A full semiconductor-universe rescan across 71 U.S.-listed tickers, ranking short-dated option candidates by tradability, OI, 10x/100x move math, and the SKHY/TSMC/ASML/OPEX event window.
AI Power and Compute Supply Map: Who Has Turned MW Into Contracts?
A visual map of listed AI power, colocation and AI cloud providers, separating secured power, contracted capacity, live AI cloud revenue and still-unproven power options.
Korea Margin Balance Weekly Monitor: KOSDAQ Deleveraging Is the Signal
A KOFIA FreeSIS-based weekly monitor for Korea margin financing balances, split by KOSPI and KOSDAQ, with investor-deposit context through 2026-06-30.
QCOM Investor Day 2026: How Strong Are the Dragonfly Technologies?
Updated DYOR on Qualcomm Investor Day 2026: a product-line audit of Dragonfly C1000 CPU, HBC, AI200/AI250/AI300, connectivity, custom silicon, Modular software, and competitive validation against NVIDIA, AMD, Broadcom, Marvell, AWS, and Google.
SK Hynix: Micron Read-Through, Next Earnings and SKHY Rerating
A source-backed forecast for SK Hynix after Micron Q3 FY2026, covering next-quarter scenarios, Nasdaq ADS impact, and a side-by-side SK Hynix versus Micron comparison.
CoPoS and Glass Substrates From Zero to One: An AI Packaging Investment Map
A source-backed investment map for CoPoS and glass core substrates, separating the technology from the trade: definitions, pros and cons, bottlenecks, timelines, and listed-company exposure.
Ibiden 4062.T: Global AI Package Substrate Chain and Competition Map
A visual DYOR report on Ibiden 4062.T, mapping its role in global AI package substrates, ABF/FC-BGA competition, market-share caveats, valuation pressure and verification triggers.
High-End MLCC vs HBM: AI Hardware Demand, Bottlenecks, and Expansion Difficulty
High-end MLCC is not an HBM substitute and not an EMIB/CoWoS substitute. HBM is a memory bandwidth bottleneck close to the accelerator. MLCC is a power-integrity and reliability bottleneck. Both benefit from AI server complexity, but their value density, expansion economics and earnings transmission are very different.
QQQ CPI Options Playbook: Call/Put Branches, Early-Exit P&L and Hedges
A static QQQ CPI options playbook for June 10, 2026, combining bullish calls, bearish puts, early-exit P&L, trigger levels, hedges, and execution rules.
Vera Rubin and Vera CPU: A Serenity Bottleneck Map for the AI Factory Supply Chain
A current Vera Rubin and Vera CPU supply-chain map that separates core names from Serenity-style bottlenecks: unavoidable links that may still be underwritten as old-industry companies.
2026-06-04 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-06-04, bundling global news, U.S. events, and cross-border product research.
2026-06-02 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-06-02, bundling global news, U.S. events, and cross-border product research.
2026-05-29 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-29, bundling global news, U.S. events, and cross-border product research.
LITE Execution Plan: Naked Calls First, Then Call Spreads
This version splits the call-spread plan into two stages. Stage one uses the Jul 17 2026 $1100C as a small tactical naked call to catch the first repair move after LITE reclaims $900/$920. The Nasdaq snapshot showed bid $48.00, ask $50.20, and mid around $49.10, or about $4,910 per contract.
IBM High-Odds Call Plan: Entries, Sizing, and Payoff Ratios
This is not a high-probability plan. It is a defined-risk attempt to buy convexity in IBM with no more than roughly $5,000 of option premium at risk. Because the premium can go to zero, entries must be tied to triggers rather than discretion.
ARM Options Plan: Target $480, Naked Calls First, Then Sep Spreads
ARM can be traded for a $480 target, but it is more of a high-volatility momentum trade than a certainty trade. From $335.27, $480 requires about +43% upside by 2026-09-18. The payoff comes from volatility and trend continuation; the discipline comes from confirmation and sizing, not valuation support.
MLCC, EMIB and silicon capacitors: core AI upstream tickers
EMIB is not an MLCC substitute. MLCCs stabilize power at the board and module level; EMIB is an advanced packaging interconnect; silicon capacitors push decoupling closer to the package. They benefit from the same AI hardware complexity, but they solve different physical problems.
2026-05-28 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-28, bundling global news, U.S. events, and cross-border product research.
MRVL Q1 FY2027: AI Networking Becomes the Bottleneck
The most important part of Marvell's Q1 FY2027 report is not the size of the Q1 beat. It is the forward reset: Q2 revenue guidance of $2.7B, FY2027 revenue near $11.5B, and FY2028 revenue around $16.5B.
2026-05-27 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-27, bundling global news, U.S. events, and cross-border product research.
2026-05-26 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-26, bundling global news, U.S. events, and cross-border product research.
How Warming Ferments Into the Economy: A 2026-2027 Timeline Map
Shortest answer: it has started, but it is still mostly a marginal pricing signal. The more visible window for households and markets is Q3 2026 through H1 2027.
2026-05-25 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-25, bundling global news, U.S. events, and cross-border product research.
2026-05-24 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-24, bundling global news, U.S. events, and cross-border product research.
2026-05-23 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-23, bundling global news, U.S. events, and cross-border product research.
2026-05-22 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-22, bundling global news, U.S. events, and cross-border product research.
Bitcoin Miners' Power-to-AI Pivot: BTDR vs HUT vs IREN vs CIFR
The core variable is no longer hash-rate ranking. It is whether power can be upgraded into financeable AI load. HUT and CIFR have already converted part of their power estates into long-duration AI colocation leases; IREN has pushed meaningful capacity into AI Cloud contracts and GPU cloud economics; BTDR owns a 3.0GW raw power portfolio and a fast-growing AI Cloud ARR base, but its large-scale AI colocation contract proof still lags. The highest certainty today is HUT, the highest beta is IREN / CIFR, and the largest relative re-rating option is BTDR if Tydal and its U.S. sites sign credible tenants.
ARM / QCOM / INTC / AMD: Four Chip Capacity Models
The four companies do not answer the same capacity question. Arm primarily sells IP, so capacity sits with licensees and the ecosystem. Qualcomm is mostly a fabless SoC vendor with some owned RF/filter manufacturing. Intel is the only one with large-scale owned wafers and advanced packaging. AMD is a fabless CPU/GPU/AI accelerator company whose upside depends heavily on TSMC, advanced packaging, and HBM supply.
Vera Rubin Racks at $7.8M: Who Really Benefits?
The easy read is 'memory stocks rallied, so buy memory.' The better read is that Vera Rubin turns the AI server from a GPU-centered product into a rack-scale system. Every component that keeps GPU utilization high starts to receive more BOM weight.
2026-05-21 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-21, bundling global news, U.S. events, and cross-border product research.
SpaceX IPO and Space Stocks: RKLB Upside, Proxy Risk, and Dilution
The first-order reaction to SpaceX's S-1 is obvious: the space sector finally gets a publicly traded leader with scale, brand power, launch dominance, Starlink, NASA relationships, and a broader AI/orbital-compute narrative. Public space stocks have mostly been partial exposures: Rocket Lab for launch plus space systems, AST SpaceMobile for direct-to-device, Intuitive Machines for lunar services, and Planet Labs or BlackSky for Earth-observation data.
T1 Energy / TE: A High-Leverage U.S. Solar Manufacturing Turnaround
The TE bull case is not simply 'AI needs power, so every energy stock works.' It is a narrower and more fragile thesis: if T1 links G1_Dallas module revenue, G2_Austin cell production, 45X/domestic-content eligibility, and non-related customer demand, it can become a scarce U.S. solar manufacturing asset. If G2 financing or FEOC/45X eligibility breaks, common equity absorbs heavy downside through leverage and dilution.
2026-05-20 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-20, bundling global news, U.S. events, and cross-border product research.
Sivers / SIVEF: A Laser-Source Bottleneck Candidate in AI Photonics
Sivers Semiconductors is easy to label as AI photonics, CPO, 1.6T, SATCOM, or defense. The cleaner first-principles view is narrower: it is not a GPU vendor, switch ASIC vendor, full optical-module vendor, or hyperscaler network architect. It combines two enabling component layers: high-power DFB/CW laser arrays in Photonics and mmWave RFIC/beamforming technology in Wireless.
2026-05-19 Daily Research Briefing: News and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-19, bundling global news, U.S. events, and cross-border product research.
2026-05-18 Daily Research Briefing: Markets, News, and Cross-Border Products
A daily YoloLab writing snapshot for 2026-05-18, bundling market regime, global news, U.S. events, and cross-border product research.
POET / MXL / HIMX: three layers of AI interconnect optionality
POET, MXL and HIMX can all be mapped to AI interconnect, optics, CPO or edge AI, but the first-principles layers are different. POET is a manufacturing-platform option: can Optical Interposer / EOI move optical-engine production closer to wafer-scale integration? MXL is the signal-chain layer: optical modules and AI data-center links need PAM4 DSPs, TIAs and retimers. HIMX is a display and ultra-low-power sensing company with AR, WiseEye and CPO optionality through FOCI.
Cerebras WSE: The Wafer-Scale Answer to AI Inference
Cerebras's Wafer-Scale Engine (WSE) treats an entire 12-inch silicon wafer as a single chip, rather than slicing it into hundreds of small GPUs and wiring them back together like NVIDIA does.
U.S. optical earnings map: where the AI interconnect bottleneck sits
From first principles, AI optics is not a theme label. As AI clusters grow denser, the cost of moving data across GPUs, racks, data halls and data centers rises sharply. GPUs are the compute bottleneck; optical interconnect is the data-movement bottleneck.
Big Four AI CapEx receiver chain
This report uses the 2026-04-29 earnings cycle and later capex summaries as the base: Amazon around $200B, Microsoft around $190B, Alphabet/Google at a $185B midpoint, and Meta at the $135B midpoint of its $125B-$145B range.
1.6T optical order chain
The key question for 1.6T is not whether demos are exciting, but whether the chain has moved from sampling to repeatable volume logic.
AMD Q1 2026 earnings: can AI demand become sustained delivery?
AMD’s quarter moved from narrative-led momentum to delivery pacing: AI infrastructure growth is clearly visible in both revenue and non-GAAP EPS.
2026/2027 global profit top 10
This Top 10 is not a trading forecast list yet. It is a reproducibility list for global profit capacity from 2026 to 2027.
Memory supercycle
Memory valuation cannot be treated as one basket. HBM and NAND/SSD have different operating drivers.
AXTI material beta
The issue with AXTI is not topic relevance alone. The test is whether material exposure maps into verifiable downstream order flow.
Earnings trade checklist
Earnings day is not a direction guess around beat/miss. It is a test of whether information clears the pre-quoted volatility hurdle.
AI interconnect comp map
In AI interconnect, profit attribution must stay layered: ASIC/DSP, photonic devices, modules, and materials are different profit engines.